Apple reportedly weighs Intel’s 18A-P for 2027 entry-level Mac chips, challenging TSMC’s exclusive grip

Despite Nvidia CEO Jensen Huang and many industry veterans arguing that former TSMC senior vice president Wei-Jen Lo joining Intel will not materially affect TSMC — given the sheer complexity of modern semiconductor manufacturing and the impossibility of any single “hero” reshaping the field — the market is now weighing a more strategic angle behind Intel CEO Lip-Bu Tan’s unusually strong public endorsement of Lo.

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Micron reportedly plans new Hiroshima fab to reduce reliance on Taiwan production

Micron Technology is reportedly planning to invest JPY1.5 trillion(US$9.6 billion) to establish a new high-bandwidth memory (HBM) manufacturing facility at its Hiroshima campus, according to Nikkei. The initiative aims to increase production of advanced chips designed for artificial intelligence (AI) systems and to lessen the company’s dependence on Taiwan amid growing concerns over global supply chain vulnerabilities.

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Taiwan weighs long-term space strategy as scientists push for greater role

The Taiwan Space Union (TSU) recently convened a Satellite Science Workshop, where participants noted that the high cost of space research and development has led to a shift in government space policy toward mission-driven goals, leaving limited room for science-led initiatives. Taiwan’s updated Phase III 2.0 national space program, they said, is now anchored even more tightly to two priorities: national security and industrial development.

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Taiwan sees highest weekly average of cyberattacks in Asia Pacific, says Fortinet executive

Taiwan is experiencing the highest weekly average of cyberattacks in the Asia-Pacific region, distinguished by a notably large share of attacks targeting the “impact” phase, according to Fortinet’s latest threat intelligence data. Derek Manky, Fortinet’s global threat intelligence vice president, shared insights with DIGITIMES, revealing Taiwan’s cybersecurity landscape deviates significantly from global patterns observed in the first three quarters of 2025.

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A decade-old cooling idea returns as AI servers overheat

Rising power consumption in AI accelerators is pushing chipmakers to seek new thermal solutions. Jentech Precision general manager Lin Chin-lung said the company developed its Microchannel Lid a decade ago, yet the technology drew little interest until chipmakers began revisiting it over the past three years, with momentum accelerating in the last two. Customers are now focused on its two core benefits: substantially stronger heat dissipation and thinner system design, both critical for next-generation AI servers.

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Samsung and SK Hynix to unveil next-gen memory tech at ISSCC 2026

At the upcoming International Solid-State Circuits Conference (ISSCC) 2026 in February, Samsung Electronics and SK Hynix are set to unveil significant advances in high-performance memory. Samsung plans to showcase a redesigned 6th-generation high-bandwidth memory (HBM4) delivering 3.3TB/s of bandwidth, while SK Hynix will introduce its latest high-speed LPDDR6 and GDDR7 products.

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India commits US$500 million to modernise SCL Mohali and boost domestic chip production

India will invest INR45 billion (approx. US$500 million) to modernise and expand the Semiconductor Laboratory (SCL) in Mohali, India’s Union Electronics and IT Minister Ashwini Vaishnaw said during a review visit. The minister reaffirmed that SCL would “not be privatized” and would instead undergo a major upgrade aimed at significantly boosting domestic chip production and strengthening India’s strategic semiconductor capabilities.

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