Outsourced semiconductor assembly and testing (OSAT) vendors continue to enjoy strong order pull-in for high-end chips used in automotive, high-performance computing (HPC), and server device applications, which will fill up related bumping, flip chip ball grid array (FC-BGA), land grid array (LGA), and other advanced packaging capacities through the second half of 2022, according to industry sources.

Some Taiwan-based diode and MCU suppliers have extended their chip offerings for niche markets, such as middle- to high-end high-speed transmission, high-performance computing, and automotive applications, and are beginning to realize business benefits.

TSMC and other chipmakers have seen no cutback in orders for datacenter applications, despite market concerns raised recently about Meta Platforms’ and Google’s potential capex cuts, according to industry sources.