Samsung Electronics chairman Jay Y. Lee reportedly met Tesla CEO Elon Musk on December 11, 2025, local time at Samsung’s semiconductor plant in Texas, underscoring a deepening partnership as the South Korean chipmaker prepares to launch advanced chip production in the US and stabilize manufacturing yields for Tesla’s next-generation processors.

Latest media reports state that SK Hynix has completed the final verification phase for customer samples of its 12-layer sixth-generation high-bandwidth memory (HBM4) prior to mass production. The Korea Herald reported that SK Hynix has effectively entered the mass production process for its 12-layer HBM4 products and is supplying customers with more than 20,000–30,000 paid HBM4 samples. After establishing a global 12-layer HBM4 mass production system in September 2025, SK Hynix finalized a 2026 HBM4 supply contract with Nvidia and has begun production, according to Deal Site and other South Korean media. Meanwhile, Samsung Electronics is approximately three to four months behind schedule.

Samsung Electronics is reportedly in talks with Advanced Micro Devices about producing next-generation chips using its second-generation 2nm process, as the South Korean technology group seeks to secure major customers and revive its loss-making foundry business, according to industry sources and reports from South Korea’s Seoul Economic Daily and G-enews.

Foxconn plans to invest NT$15.9 billion (approx. US$510 million) to build a flagship headquarters in southern Taiwan, deepening its footprint in Kaohsiung as the contract electronics manufacturer accelerates its expansion into electric vehicles, artificial intelligence, and software-driven services.