On the opening day of Hon Hai Tech Day, Foxconn introduced a new reference EV, the Model A—its most concentrated focused push yet to tailor electric vehicles for specific industries and use cases. Jun Seki, chief strategy officer for the company’s electric-vehicle business, unveiled three distinct versions of the Model A on the main stage, each designed for different commercial and consumer needs. The vehicles combine advanced AI features with a modular component architecture aimed at driving down costs and broadening application scenarios.

Foxconn chairman Young Liu stated that the company would announce a collaboration with OpenAI at Hon Hai Tech Day (HHTD25). On the morning of November 21, Foxconn confirmed it will work with OpenAI to design next-generation AI infrastructure hardware and manufacture it in the US. OpenAI CEO Sam Altman later appeared via video call at HHTD25 to outline the partnership.

Samsung Electronics is reportedly planning to raise the monthly output of its next-generation 2nm foundry process to as many as 21,000 wafers by the end of 2026, according to new industry projections. The increase would represent a 163% jump from 2024 and could significantly narrow the company’s long-standing performance and capacity gap with TSMC.

Mitsubishi Fuso Truck and Bus Corporation (MFTBC) is drawing on its nine decades of experience as it seeks new opportunities in the global bus market. According to Katsuto Kora, director and head of Fuso Bus, the Fuso brand is “deeply rooted in Japan but unmistakably international,” reflecting both its longevity and global reach.