Samsung Electro-Mechanics poised to enter Nvidia NVSwitch substrate supply chain

Samsung Electro-Mechanics (Semco) has secured its first supply role with Nvidia, the world’s leading GPU manufacturer, to provide high-end flip chip ball grid array (FC-BGA) substrates for NVSwitch systems. According to South Korea’s Seoul Economic Daily, the agreement marks the company’s first engagement as a supplier of these specific components to Nvidia.

Continue reading

Taiwan-US sign Pax Silica Declaration to boost trusted AI and advanced robotics

The sixth US-Taiwan Economic Prosperity Partnership Dialogue (EPPD) recently concluded with the signing of a joint statement on the Pax Silica Declaration and US-Taiwan Cooperation on Economic Security. The Chinese National Association of Industry and Commerce (CNAIC) expressed strong support, highlighting that the dialogue precisely focused on complementary strengths between Taiwan and US industries, facilitating deep collaboration in trusted AI and advanced robotics.

Continue reading

Aito’s surge lifts Seres to front of China’s EV race

After Huawei transferred the “Aito” brand and related patents to Seres for CNY2.5 billion (approx. US$359 million), Seres has rapidly consolidated its position in China’s fast-growing new-energy vehicle (NEV) market. While Huawei no longer owns the brand, it continues to provide Seres with technical and marketing support, including smart cockpit systems and advanced driver-assistance technologies.

Continue reading

Winbond’s 2027 DRAM capacity pre-sold as memory revenue nears NT$100B in 2025

The structural shortage in the memory market is driving a surge in supply chain operations, with reports indicating that Winbond recently finalized its contract pricing for the first quarter of 2026. The company expects DRAM price increases from the fourth quarter of 2025 to sustain through the second quarter of 2026, marking three consecutive quarters of growth and effectively doubling contract prices year-over-year. Furthermore, Winbond’s new production capacity planned for 2027 has already been fully booked.

Continue reading

Nvidia’s Jensen Huang joins Dassault Systèmes event to unveil 3D universe vision

Dassault Systèmes opened its annual flagship conference, 3DEXPERIENCE World 2026, on February 3 in Houston. Building on the launch of its seventh-generation development framework in 2025, centered on the “3D UNIV+RSES” concept, the company this year underscored how it is integrating AI with virtual environments to reshape the full product lifecycle, from design and simulation to manufacturing and operations.

Continue reading

Memory and upstream material price hikes squeeze profits, Chinese panel makers shift to ultra-large sizes

Rising raw material costs and exchange rate fluctuations have driven upstream panel material suppliers in China to raise prices on glass substrates, polarizers, target materials, and PCBs since 2025. Although not all suppliers succeeded in increasing prices, the overall cost pressure has pushed panel manufacturers to focus more on ultra-large-size TV panels, prompting modest capacity expansions.

Continue reading