Samsung Electronics and SK Hynix have both secured production-ready technology for 16-layer stacks of sixth-generation high-bandwidth memory, known as HBM4, positioning the two South Korean memory makers for a pivotal contest in 2026 as demand from artificial intelligence accelerators expands. While each company has demonstrated technical readiness, industry participants say yield performance, rather than headline specifications, is likely to determine market share, profitability, and supplier standing in the next phase of the HBM cycle.

Benefiting from specification upgrades in AI servers and switches, the content per box of NOR Flash is set to grow by multiples, with high-capacity specifications likely to face severe supply shortages. NOR Flash price increases in the second quarter of 2026 are expected to jump 40–50% quarter-on-quarter from the first quarter, with some product lines even seeing customers willing to pay premiums to secure supply. As for legacy-process products with tight supply, such as SLC NAND and MLC NAND, price hikes are even more aggressive. Second-quarter contract prices are rumored to see year-on-year increases of up to 400–500%, prompting Winbond Electronics to accelerate the expansion of its SLC NAND capacity.

Advanced Micro Devices (AMD) signaled a focus on operational execution and supply-chain readiness during its February 3, 2026, earnings call, positioning the first half of 2026 as a foundational period for a broader artificial intelligence (AI) platform rollout. Management framed the current phase as a transition toward a more significant ramp in the second half of the year, emphasizing deployment discipline over immediate revenue acceleration.