25
Dec
24
Dec
The complete Asus ROG Strix OLED XG34WCDMTG specifications are unveiled
24
Dec
CHT builds AI base with Kaohsiung, all-optical backbone network set for 2026
Chunghwa Telecom (CHT) is expanding its AI and infrastructure footprint by establishing a shared AI exhibition space and research and development office at Kaohsiung’s Pier F on December 22, 2025. The company will also assist Kaohsiung in building Taiwan’s first city-level generative sovereign AI demonstration base.
24
Dec
U.D. Electronic forecasts growth in 2026 as new Vietnam plant and acquisition take effect
Connector maker U.D. Electronic revealed at an investor briefing on March 23, 2025, that it expects significant growth momentum in 2026, driven by the commissioning of its Vietnam manufacturing plant and the integration of Linkpower Electronics. The company highlighted that AI servers and edge computing are pushing transmission speed upgrades, with products supporting speeds above 2.5G projected to exceed 30% of sales next year.
24
Dec
FIC Group’s optical communication expansion signals improved outlook
FIC Group reported strong demand from its optical communication customers amid ongoing supply shortages. The company’s new Johor Bahru, Malaysia production facility recently passed customer certification. It is slated to begin mass production in the first quarter of 2026. FIC also announced plans for continued capacity expansion at the Johor plant throughout 2026 while exploring semiconductor precision manufacturing growth opportunities.
24
Dec
Japanese startup pushes diamond semiconductors toward commercialization in EVs and satellites
A Japanese startup originating from Waseda University, Power Diamond Systems (PDS), showcased its diamond-based semiconductors at SEMICON Japan 2025, presenting for the first time an evaluation system that confirmed the devices’ operation after packaging.
24
Dec
PC giants rush to lock in memory supply as prices surge toward a new supercycle
As the global memory market enters its sharpest price upswing in nearly five years, one top-tier PC maker has moved quickly to lock in supply, dispatching senior executives to negotiate directly with major memory producers, including Samsung Electronics, SK Hynix, and Micron Technology.
24
Dec
Unimicron leases Dajia plant to Uniflex, spins off flexible PCB business
Taiwan-based IC substrate maker Unimicron recently announced that it will sublease part of its Taichung Dajia land and factory to its flexible PCB (FPCB) subsidiary Uniflex Technology. The move addresses overseas customers’ non-China production requirements.
24
Dec
Samsung, SK Hynix reportedly hike HBM3E prices nearly 20% ahead of 2026 shift
South Korean memory giants Samsung Electronics and SK Hynix have reportedly hiked prices for fifth-generation high-bandwidth memory by nearly 20% for 2026 deliveries, as soaring demand for artificial intelligence accelerators outstrips supply, according to industry sources. The price increase for HBM3E chips comes as manufacturers pivot production resources toward next-generation HBM4 technology, creating an unusual supply crunch for the current industry standard.
24
Dec
HTC eyes China launch for Vive Eagle AI glasses in January 2026
Following the launch of its first AI glasses, Vive Eagle, HTC has continued to expand its sales channel footprint. Beyond its official rollout in Hong Kong, the company has increased physical demo locations and after-sales service points in Taiwan. HTC is also expected to hold an event in China in January 2026. If AI glasses are introduced in the country, market attention will center on local partnerships, AI function localization, as well as sales targets and go-to-market strategy.