As advanced packaging technologies continue to evolve toward larger sizes and panel formats, Skytech CEO George Yi stated that in response to the key process requirements of next-generation chip-on-panel-on-substrate (CoPoS) advanced packaging, the company has completed delivery of the world’s first 310mm by 310mm panel-level packaging physical vapor deposition (PLP PVD) equipment. The equipment has been successfully introduced into the production line of a major semiconductor packaging and testing plant in Kaohsiung, Taiwan.

TSMC has formulated a plan to mass-produce advanced 3nm chips in Kumamoto Prefecture, marking an unprecedented move within Japan. The company has notified the Japanese government of this initiative, with estimated equipment investment reaching US$17 billion.

Amazon is in discussions to secure special access to OpenAI’s technology as it considers a multibillion-dollar equity investment in the AI company, according to a report by The Information. The talks highlight how major cloud providers are seeking closer relationships with leading AI model developers as competition in consumer and enterprise AI accelerates.