Meta’s next AI model, ‘Avocado,’ signals shift to closed development
Meta is reportedly developing a new AI model, code-named “Avocado,” slated for release in the spring of 2026.
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Dec
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Dec
Inventec wins Datasection server deal to supply first B300 AI supercluster
Japanese software service provider Datasection has signed an agreement with Inventec to purchase 1,250 servers equipped with 10,000 Nvidia B300 GPUs. The company plans to build a world-class, first-of-its-kind large-scale AI cluster featuring Nvidia B300 GPUs in Sydney, Australia.
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Dec
Taiwan forms computing alliance to advance sovereign AI applications
Taiwan officially launched a new government-funded cloud computing center on December 12, 2025, marking a major step in boosting domestic artificial intelligence (AI) capabilities. President Lai Ching-te highlighted that Taiwan not only leads in advanced chip manufacturing but also possesses world-class capabilities in systems integration and supercomputing technologies.
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Dec
Unitech aims for 20% revenue from SE Asia LEO orders in 2026
Automotive PCB manufacturer Unitech Printed Circuit Board Corp. is expanding into the low Earth orbit (LEO) satellite market. However, its Thailand plant did not meet customer demand outside the Greater China region in 2025. As a result, overall order momentum slowed, and revenue share fell below 15%. The company expects that once local production normalizes in the second quarter of 2026, the revenue share will rebound to around 20%.
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Dec
Qualcomm sharpens RISC-V influence with Ventana acquisition
Qualcomm’s acquisition of Ventana Micro Systems signals a clear push to deepen its commitment to RISC-V and accelerate the maturation of the surrounding ecosystem.
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Dec
Samsung chair, Musk reportedly meet at Texas fab as chip output looms
Samsung Electronics chairman Jay Y. Lee reportedly met Tesla CEO Elon Musk on December 11, 2025, local time at Samsung’s semiconductor plant in Texas, underscoring a deepening partnership as the South Korean chipmaker prepares to launch advanced chip production in the US and stabilize manufacturing yields for Tesla’s next-generation processors.
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Dec
SK Hynix taps ASMPT for HBM4 TC bonders amid Hanmi-Hanwha patent clash
SK Hynix has reportedly placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT as it accelerates preparations for HBM4, underscoring both the strategic importance of advanced packaging equipment and rising complexity in the TC bonder supply chain amid a patent dispute between South Korean rivals Hanmi Semiconductor and Hanwha Semitech. The move reflects SK Hynix’s broader push to diversify critical equipment suppliers while aligning with Nvidia’s next-generation AI roadmap.
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Dec
SK Hynix leads Samsung by 3-4 months, begins supplying paid HBM4 samples
Latest media reports state that SK Hynix has completed the final verification phase for customer samples of its 12-layer sixth-generation high-bandwidth memory (HBM4) prior to mass production. The Korea Herald reported that SK Hynix has effectively entered the mass production process for its 12-layer HBM4 products and is supplying customers with more than 20,000–30,000 paid HBM4 samples. After establishing a global 12-layer HBM4 mass production system in September 2025, SK Hynix finalized a 2026 HBM4 supply contract with Nvidia and has begun production, according to Deal Site and other South Korean media. Meanwhile, Samsung Electronics is approximately three to four months behind schedule.
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Dec
TASC partners with Itochu Taiwan to deepen compound semiconductor and smart medical ventures
Taiwan-Asia Semiconductor Corporation (TASC) is advancing its layout in compound semiconductors and non-invasive blood glucose monitoring technology through the signing of a memorandum of understanding (MOU) with Itochu Taiwan. The agreement seeks to facilitate collaboration in these two sectors through the pooling of resources and semiconductor supply chains.
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Dec
HDD prices see largest increase in eight quarters, with surging demand in China and US markets
The traditional hard disk drive (HDD) market experienced a rare sharp price surge in recent years. In contract price negotiations for the fourth quarter of 2025, HDD product prices were finalized with a quarter-over-quarter increase of approximately 4%, marking the highest growth rate in the past eight quarters.