‘Chipflation’ hits Samsung, boosts Apple results

As soaring memory prices fuel “chipflation,” Samsung Electronics and Apple are taking sharply different approaches. Samsung’s Mobile eXperience (MX) division is trying to protect profitability by optimizing its product mix and expanding across more price points, while Apple is leaning on an ecosystem of 2.5 billion devices and high-margin services to offset rising component costs.

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Hyundai’s robot ecosystem strategy rejects all-purpose humanoids in favor of application-specific products

Robots have become a main focus for Hyundai Motor Group, with continued investments in research and development as part of its strategy for the future. However, rather than promoting the broad adoption of humanoid robots, Hyundai is instead pursuing robots tailored for specific industries, pushing a range of new technologies in a diverse range of solutions and ecosystems.

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VIS joins CoWoS chain with TSMC-backed Singapore interposer foundry

Vanguard International Semiconductor (VIS) said on May 5 that it has secured support from TSMC for a new interposer foundry line at its 12-inch Singapore fab, alongside a broader push into the CoWoS supply chain. The company said the move will accelerate capacity expansion and lower capital expenditure requirements as demand stabilizes after year-endinventory corrections.

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AEM CEO says AI upends semiconductor testing

Singapore semiconductor equipment and testing company AEM is facing a dual challenge of “physics and cost” as the AI era rewrites the limits and supply-chain logic of chip testing, CEO Samer Kabbani said. AI is also driving up to US$7 trillion in global infrastructure investment, he said, while forcing the industry to adapt to faster product cycles and far larger, more power-hungry packages.

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Taiwan researchers create non-toxic blue-light material that could enable glasses-free 3D displays

Researchers at National Yang Ming Chiao Tung University announced a new non-toxic, metal-free light-emitting silicone that produces blue fluorescence when mechanically stressed, a development they said could advance glasses-free 3D displays and wearable imaging sensors. The research was published on May 6 in the journal JACS Au, and the work was carried out in collaboration with a team at Osaka Institute of Technology, the university stated.

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Intel Capital leads QuantWare’s US$178 million bet on hyperscale quantum computing ambitions

QuantWare’s US$178 million Series B round aims to accelerate the global rollout of larger, industrial-scale quantum processors, promising hyperscale quantum compute through its VIO-40K architecture and KiloFab foundry — a development that could reshape supply chains, national technology capabilities, and industrial adoption for countries seeking scalable quantum computing.

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