Technology giants are continuing to expand AI computing infrastructure, driving demand for high-performance optical interconnect components. US optical communications leaders Coherent and Lumentum are actively developing 6-inch indium phosphide (InP) wafer production technology. Industry sources said 4-inch wafers remain the mainstream format, but fast-growing demand in optical communications is accelerating the shift toward 6-inch substrates. Supply constraints, however, persist, with substrate technology maturity and supply availability cited as the main bottlenecks.

Huawei has continued to pursue patent litigation against networking equipment makers in Europe in recent years, with its latest case targeting a Taiwanese vendor. Sercomm recently disclosed that its German subsidiary, Sercomm Deutschland GmbH, had received a lawsuit from Huawei over certain Wi-Fi 6 products sold in Germany and other markets.

South Korea has moved its Physical AI Alliance from a policy-setting body into an operational platform, as the government and companies such as Naver deepen cooperation with Nvidia on physical AI, AI factories and large-scale computing infrastructure.