LG Group execs visit Nvidia to expand physical AI and robotics ties

LG Group dispatched senior executives to Nvidia’s headquarters in Santa Clara, California, on June 22, 2026, to negotiate expanded cooperation in physical AI and robotics, following a leadership meeting between the two companies in Seoul on June 8, 2026. The delegation comprised more than 30 people from LG affiliates to explore commercialization opportunities, priority projects, and a partnership model that integrates the group’s core capabilities.

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TECO, Billion Watts and Tun Green Power form JV to develop Australia solar and storage projects

TECO Electric & Machinery’s Australia unit, Billion Watts, and Tun Green Power announced a strategic partnership to develop the Seaspray solar and battery energy storage project in Victoria, Australia, and formed a local joint venture to pursue follow-on investments, according to the partners. The partners said the move marks their formal entry into the Australian renewable energy market and the beginning of planning for a second set of projects.

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Commentary: Google defines AI path to ASI, validates chip boom

Google released a 30,000-word AI roadmap on June 14 that, for the first time, clearly defines AI having the capability of 100 million humans as a key milestone on the path to artificial superintelligence (ASI). The plan outlines a three-stage evolution from today’s large models to artificial general intelligence (AGI) and then ASI, reinforcing expectations that AI capabilities will keep expanding at an exponential pace.

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High-end fiberglass cloth supply tightens; shortages to persist through 2027

Demand for high-end fiberglass cloth is surging on the AI boom, and orders from copper-clad laminate (CCL) customers are leaving the world’s two largest suppliers, Nittobo and Taiwan Glass, short of capacity. In particular, low coefficient of thermal expansion (CTE) and low Dk2 products remain the tightest, with supply-demand gaps now expected to last through 2027.

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Wafer Works unveils golden triangle expansion to boost AI, optical, and SiC wafer capacity

Wafer Works announced after its June 18, 2026, shareholders meeting that it launched a “golden triangle” expansion plan to deepen silicon wafer product lines and support fast-growing applications in advanced packaging, optical transmission and third-generation semiconductors. The rollout covers simultaneous construction and capacity ramp projects at Erlin, Zhengzhou, and Zhunan to align production with customer validation and mass-production targets.

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Gogoro to unveil upgraded in-wheel motor scooter as Taiwan EV demand recovers

Gogoro is preparing to launch a new electric scooter on June 23, 2026, that industry supply-chain sources said will feature an in-wheel motor, dual batteries and upgraded performance aimed at the 100-125cc gasoline scooter segment. The announcement comes as Taiwan’s electric scooter market moved from a weak start in 2026 to a gradual recovery, supported by local subsidies, affordable new models and high-profile cross-brand collaborations.

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AI demolishes traditional tech: how NPUs and AI RAN are rewriting European infrastructure

AI is no longer a localized software novelty. It is now aggressively wiping out traditional hardware infrastructure across Europe. According to new market intelligence reports from CONTEXT World, there has been an unprecedented displacement of legacy systems. Driven by complex professional workflows, massive public sector procurement, and a fundamental restructuring of telecommunications networks, AI-optimized hardware has transitioned from a progressive choice to an absolute operational necessity.

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