SK Hynix briefly overtook Samsung Electronics on June 22 to claim the top spot by common-share market capitalization on South Korea’s KOSPI exchange, a milestone that reflects how high-bandwidth memory (HBM) has redefined the value of Korea’s semiconductor industry.
The memory industry is entering a super cycle as prices keep soaring, with industry sources saying third-quarter 2026 contract price gains show no sign of slowing amid tight supply from upstream vendors. Overall increases could reach 30% to 40%, after second-quarter 2026 contract prices already climbed 40%. As market prices continue to stack higher in the second half, profits at the top three memory manufacturers are set to expand sharply, driving a surge in full-year memory business earnings.
The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMES has been tracking the latest developments in TSMC’s CoPoS advanced packaging technology, with glass core substrates emerging as the most closely watched variable in that story.
Physical AI and ADAS-cockpit integration have become the two main forces driving upgrades in China’s autonomous driving and smart cockpit supply chains, according to the latest report from DIGITIMES Research. Under this trend, automakers and tech companies are accelerating the deployment of world models and LLMs, with a new wave of mass production and commercial pilot runs expected in the second half of 2026.
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