High-capacity memory shortages worsen: Team Group reveals edge AI strategy amid rising price pressures
As memory shortages worsen, Team Group is aggressively deepening its footprint in the industrial control market. Vice general manager Shao-An Hsia noted that with AI applications accelerating their expansion from the cloud to the edge, industrial and edge system manufacturers must pivot away from competing head-on with cloud giants for component supply. Instead, they need to rely on flexible specification adjustments and specialized hardware protection technologies. In driving edge AI adoption, memory suppliers will serve as “icebreakers” during the commercialization process.
Murata considers bigger MLCC expansion as AI server demand extends beyond 2028
Murata Manufacturing is considering a new, potentially larger expansion of multilayer ceramic capacitor (MLCC) capacity beyond its existing investment plans, as demand from AI servers is expected to remain strong through the end of the decade.
AI servers are eating MLCC capacity, and Chinese suppliers are taking what’s left
AI servers are reshaping the global multilayer ceramic capacitor (MLCC) market. Murata Manufacturing and Samsung Electro-Mechanics (SEMCO) are steering limited capacity toward high-value server components, tightening conventional supply, lifting prices, and creating an opening for Chinese suppliers in PCs.
China’s Guoxin Micro buys its way into power-chip manufacturing
Unigroup Guoxin Microelectronics plans to acquire WeEn Semiconductors for CNY1.9 billion (≈ US$283 million), giving the Chinese specialty IC supplier in-house wafer manufacturing and a faster route into power semiconductors.
MediaTek unveils first 2nm chip to run 30 billion AI models on phones arriving this quarter
MediaTek has become the first merchant silicon vendor to announce a 2-nanometer smartphone processor, unveiling the Dimensity 9600 Pro on Tuesday as the industry races to run heavy artificial intelligence models entirely within the thermal and memory envelopes of a handheld device.
Interview: Corning sees CPO, glass core as new semiconductor battlegrounds
As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics (CPO), glass core substrates (GCS), and fan-out panel-level packaging (FOPLP) to the forefront of industry attention. Corning is expanding its footprint across the semiconductor supply chain by leveraging its core strengths in advanced glass formulations and optical fiber technologies, collaborating closely with value-chain partners to navigate next-generation technological shifts.
Wiwynn deepens US AI server footprint with US$1.6 billion Texas manufacturing hub
South Korea updates AI safeguards as Microsoft sets shutdown rules
South Korea is updating its artificial intelligence security guidance as companies deploy AI agents capable of operating with limited human supervision, while Microsoft is proposing model-level rules requiring its systems to remain subject to human interruption and shutdown.
BYD’s 2027 triple play could rewrite the EV race
BYD is lining up solid-state batteries, faster charging, and higher-level automated driving around 2027, potentially removing several of the remaining barriers separating electric vehicles from gasoline cars.