High-capacity memory shortages worsen: Team Group reveals edge AI strategy amid rising price pressures

As memory shortages worsen, Team Group is aggressively deepening its footprint in the industrial control market. Vice general manager Shao-An Hsia noted that with AI applications accelerating their expansion from the cloud to the edge, industrial and edge system manufacturers must pivot away from competing head-on with cloud giants for component supply. Instead, they need to rely on flexible specification adjustments and specialized hardware protection technologies. In driving edge AI adoption, memory suppliers will serve as “icebreakers” during the commercialization process.

Continue reading

Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics (CPO), glass core substrates (GCS), and fan-out panel-level packaging (FOPLP) to the forefront of industry attention. Corning is expanding its footprint across the semiconductor supply chain by leveraging its core strengths in advanced glass formulations and optical fiber technologies, collaborating closely with value-chain partners to navigate next-generation technological shifts.

Continue reading