魅族新款旗舰手机魅族22亮相，还有智能眼镜、Flyme等
9月15日，魅族正式发布全新旗舰手机魅族22，售价2999元起。会上同步推出AI拍摄眼镜StarV Snap、PΛNDΛER系列配件，以及Flyme AIOS 2和Flyme Auto 2系统升级，展示了其在智慧生态领域的最新成果。
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Sep
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Sep
Q2全球生产3亿部智能手机
9月16日消息，据外媒报道，有市场研究机构发布的报告显示，在需求季节性变化及部分厂商调整库存的推动下，今年二季度全球智能手机的产量同比环比双双增加，达到了3亿部，同比增长4.8%，环比增长4%。
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Sep
机构：Q2全球智能手机出货量同比增长3%
9月15日，Counterpoint发布数据显示，2025年Q2，全球智能手机出货量同比增长3%，实现连续第二个季度增长。
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Sep
河南：加快高端芯片研发 做强人工智能手机、个人计算机、大模型一体机等整机
河南省人民政府办公厅印发河南省加快人工智能赋能新型工业化行动方案（2025—2027年）提出，突破人工智能终端。加快高端芯片研发，做强人工智能手机、个人计算机、大模型一体机等整机。
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Sep
奥来德与京东方签署战略合作框架协议
近日，吉林奥来德光电材料股份有限公司（以下简称“奥来德”）与京东方科技集团股份有限公司（以下简称“京东方”）在北京正式签署战略合作框架协议，双方就此建立战略合作伙伴关系。
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Sep
Unprecedented AI boom pushes Quanta, Wistron, and peers into massive capacity build-up
Server ODMs are significantly expanding their production capabilities to meet the surging demand in the artificial intelligence (AI) market. Mike Yang, EVP at Quanta, revealed efforts to increase capacity at facilities in the US and Thailand, with a new plant in Mexico set to begin production in early 2026. The scale of orders has grown beyond prior expectations, driving this intensified expansion.
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Sep
Immigration raids raise doubts over Samsung’s 2026 Texas fab schedule
Samsung’s ambitious US expansion faces an unexpected obstacle that could derail its 2026 production timeline. A mounting visa crisis, triggered by immigration raids on South Korean workers, is creating ripple effects across the semiconductor industry’s most critical supply chains.
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Sep
China’s SiC pricing war forces Japan to retreat while Europe holds its line
A new phase in the global race for silicon carbide (SiC) dominance is unfolding—one shaped as much by geopolitics as by market forces. As Chinese manufacturers make rapid strides in low-cost SiC wafer production, the strategic consensus around this next-generation semiconductor material is beginning to fracture.
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Sep
Commentary: HiSilicon 2.0 moves from survival mode to leadership under Trump 2.0
On September 10, 2025, HiSilicon, a subsidiary of Huawei, completed significant personnel changes in its business registration—Eric Xu stepped down as chairman and legal representative, succeeded by Jeffrey Gao; the board’s senior management was also adjusted.
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Sep
Huawei’s Ren says failed Motorola deal set stage for chip self-reliance
Since Huawei established Shenzhen HiSilicon Semiconductor in 2004, its semiconductor business has supported over two decades of development and innovation within Huawei’s product ecosystem. However, from 2000 to 2003, Huawei faced one of its most challenging periods and nearly became a US company. CEO Ren Zhengfei confirmed this long-rumored episode during an interview.