Cheng Mei delivers first CoPoS equipment to ASE
Rapidus reportedly plans second Hokkaido fab for 1.4nm chips as funding gap widens, but company pushes back on timeline
Rapidus plans to begin construction on a second fabrication plant in Chitose, Hokkaido, in fiscal 2027 to produce 1.4nm and eventually 1nm chips, according to reports from Nikkei and Yomiuri Shimbun. The move underscores Japan’s push to return to the front of advanced logic manufacturing, even as Rapidus works to complete its 2nm process and secure the funding required to sustain its roadmap. However, the company has since denied this reported timeline.
Daikin targets AI cooling boom with plan to triple North America revenue
Google’s TPU strategy mounts fresh challenge to Nvidia’s GPU lead
Google’s expanding Tensor Processing Unit (TPU) strategy is emerging as a serious challenge to Nvidia’s long-running dominance in AI accelerators, particularly after a report from The Information revealed that Meta is in talks to begin using Google TPUs in its data centers in 2027 under a potential multibillion-dollar agreement.