Foxconn held a two-day year-end outlook conference starting February 9 at its Huyue headquarters in Tucheng. The event brought together nearly 1,000 employees from Taiwan and overseas, along with dozens of chairmen, general managers, and senior executives from consolidated subsidiaries and affiliated companies to review 2025 and outline the 2026 outlook. Business group leaders also gathered to exchange operational updates and reinforce group coordination.

Bearing manufacturer Jarllytec reported January 2026 revenue of NT$601 million (approx. US$19.01 million), down 18% month-over-month and 24% year-over-year. The company attributed the lower revenue compared to January 2025 to a temporary product transition gap in its 3C product line. Jarllytec expects shipment peaks for new US-based notebook models and Chinese foldable smartphones in the second quarter of 2026, which should restart momentum and drive sequential growth throughout the year.

Riding a year of extraordinary growth powered by the AI boom, Taiwan Semiconductor Manufacturing Co. (TSMC) has approved a 2026 strategy that couples record capital spending with one of the most consequential management reshuffles in its history. The board’s decisions underscore how aggressively the world’s largest contract chipmaker intends to widen its technological and organizational lead.

SK Hynix is expected to begin shipments this month of its sixth-generation high-bandwidth memory, HBM4, a high-performance, low-power semiconductor designed for Nvidia’s next-generation artificial intelligence accelerator, Vera Rubin.