Exynos comeback? Samsung nears decision on Galaxy S26 flagship chip strategy

Samsung’s Exynos flagship processors may return in the 2026 Galaxy S26 lineup, industry sources say, marking a potential revival after years on the sidelines. Built on Samsung’s gate-all-around (GAA) manufacturing process, the new Exynos chips are reportedly closing the gap with TSMC’s 3nm products in performance and power efficiency, a development insiders see as key to regaining market share.

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New aircraft, new materials: aerospace turns to thermoplastic composites

A surge in global demand across defense and aerospace sectors—including military weapons, unmanned systems, commercial aircraft, and low-Earth orbit satellites—is fueling rapid growth and pushing material requirements to new heights. Among the key beneficiaries: carbon fiber composites, prized for their high strength and lightweight properties. As performance and fuel efficiency become critical differentiators, carbon fiber has emerged as a strategic material, opening the door for suppliers to move upmarket into advanced global supply chains.

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LG Display turns three-week OLED fixes into two-day process with AI

LG Display (LGD) has fully deployed a self-developed artificial intelligence platform across its design, manufacturing, and business operations, marking a decisive push into digital and AI transformation (AX). The initiative, unveiled at the company’s recent AX online forum, has already generated more than KRW200 billion (US$140 million) in cost savings while lifting productivity and product quality.

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Nvidia’s 800V push powers GaN boom; Micro Silicon leads in testing

Following Nvidia’s announcement to initiate a revolution in AI server power technology, with plans to fully implement 800V high-voltage direct current (HVDC) power architecture designs by 2027, semiconductor testing, packaging, and wafer thinning company Micro Silicon Electronics highlighted that this trend will become a new highlight for gallium nitride (GaN) end applications. Once mass production officially ramps up, the third category semiconductor testing business is expected to experience robust growth.

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Tariff fears ease for Taiwan’s ICT leaders, but legacy industries risk harder hit

Rock Hsu, President of Kinpo Group and recipient of the Venture Capital Lifetime Achievement award, made a rare joint appearance on August 12 at Taiwan’s annual Venture Capital Association meeting, alongside Ray Chen, Chairman of the Board of Compal Electronics, and Chieh-Li Hsu, General Manager of AcBel Polytech. The gathering became a platform for candid commentary on the economic ripple effects of evolving global trade tensions.

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