China’s NAND flash race is intensifying, with Yangtze Memory Technologies (YMTC) pushing Xtacking 4.0 into mass production. The company has begun producing 267-layer 3D NAND TLC while preparing designs for devices exceeding 300 layers.

China is moving aggressively into the high-performance DRAM market dominated by Samsung Electronics and SK Hynix, with its sights set on customized high-bandwidth memory (HBM). The push for self-sufficiency is forcing South Korea’s chipmakers to rethink the risks of China’s differentiated strategy.

Nvidia’s US$10 billion investment in OpenAI is sparking discussions about its impact on the AI industry. In response, Microsoft Taiwan general manager Sean Pien expressed a positive outlook on the collaboration, stating that global tech giants continue to expand infrastructure investments and increase capital expenditures (capex) because they recognize the tangible benefits of AI applications. He also underscored the strengthening strategic partnership between Microsoft and OpenAI.