China’s CXMT moves toward IPO with global DRAM share nearing 4%

China’s leading DRAM producer, ChangXin Memory Technologies (CXMT), has entered the initial public offering phase as it targets a rapid increase in global market share, aiming to surpass the 4% threshold in the near term, according to its IPO prospectus and market estimates. The move comes as the company accelerates capacity expansion and technology upgrades to close the gap with industry leaders Samsung Electronics, SK Hynix, and Micron Technology in a market dominated by a handful of suppliers.

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Foxconn partners with Pace CCS to advance carbon capture tech in Taiwan

Foxconn (Hon Hai Precision) has teamed up with UK-based carbon capture and storage (CCS) design firm Pace CCS to establish a joint laboratory in Taiwan, focusing on developing corrosion-prevention techniques for CCS pipelines. This collaboration aims to enhance Foxconn’s position in the green energy supply chain amid rising global net-zero commitments.

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Spirox to ship self-developed TSV inspection equipment in 1H26, easing wafer fab bottlenecks

Veteran semiconductor equipment distributor Spirox has successfully entered the advanced packaging supply chain in the second half of 2025 with its self-developed advanced optical inspection equipment. Chairman Peter Chin said the product passed foundry customer validation and secured the first order for a non-destructive through-silicon via (TSV) inspection system, slated for shipment and revenue contribution in the first half of 2026. This milestone marks the group’s transition into a new business phase.

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Samsung reportedly explores side-by-side chip packaging for next-gen Exynos

Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors, as the company works to strengthen the competitiveness of its proprietary mobile silicon. The South Korea-based company is exploring a side-by-side packaging technology, internally dubbed SbS, that places the application processor and memory chips adjacent to one another rather than stacking them vertically.

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AI competition moves beyond LLMs into distribution and hardware channels

As frontier AI models reach practical usability, competition is shifting from incremental improvements in model performance to a broader battle over distribution, application integration, and cost-effective deployment, according to DIGITIMES analyst Luke Lin. Developers are now racing to secure access to end users via devices and platforms, marking a new phase in AI competition that is expected to last for the next several years.

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AOC AGON Pro AGP277QKD with 4th Gen WOLED and full HDMI 2.1 and DisplayPort 2.1 is unveiled

AOC has officially unveiled the AOC AGON Pro AGP277QKD, a next‑generation gaming monitor designed to redefine competitive play with breakthrough WOLED technology and unprecedented refresh‑rate performance. The 26.5-inch display introduces a dual‑mode system (DFR) capable of delivering QHD resolution at 540Hz or HD resolution at a staggering 720Hz, positioning it among the fastest consumer gaming…

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LG Gallery TV will debut with LG’s full Art TV lineup at CES 2026

LG Electronics will introduce the LG Gallery TV, a new lifestyle screen designed to bring a gallery-quality atmosphere into the home, at CES 2026. Aimed at interior-conscious consumers, the Gallery TV is positioned as a dedicated canvas that complements LG’s Gallery+ service, which offers a rotating library of more than 4,500 pieces of content. The product blends display technology with…

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