BenQ Materials is expanding into semiconductor materials, with president Ray Liu saying the company has entered CMP cleaning brush rollers and begun shipments to wafer fabs. It is also developing wafer grinding tapes and UV debonding tapes, which are currently under customer validation and could begin shipping as early as the end of 2026.

South Korean IC design firm AD Technology transitioned from the TSMC Value Chain Alliance (VCA) to become one of Samsung’s Design Solution Partners (DSPs) in 2019. After overcoming initial challenges, the company has returned to profitability and now aims to surpass KRW1 trillion (US$673.2 million) in revenue by 2029 or 2030 through its self-developed 2nm server platform, ADP620.

Taiwan’s minister of digital affairs, Yi-Jing Lin, recently pointed out that the Ministry of Finance (MOF) has announced a major incentive encouraging the private sector’s investments in AI computing equipment. Under the Act for Promotion of Private Participation in Infrastructure Projects, eligible investors who sign contracts with the Ministry of Digital Affairs (MODA) can enjoy significant tax benefits from their investments in AI computing equipment.

Realtek’s stronger-than-expected March and first-quarter 2026 revenues signal important implications for global supply chains and device makers, showing pull-ins in PC shipments and diversified demand that could affect component sourcing, pricing, and competition in networking, automotive, and AI chip markets worldwide over the coming quarters, as well as investor sentiment.