28
May
Nvidia’s plan to launch Rubin CPX, an inference-focused graphics processing unit for its Vera Rubin platform, has become increasingly uncertain as supply-chain activity around the product appears to have stalled, according to The Elec.
28
May
China tightens travel bans on private-sector AI to stem tech leaks
China has expanded its state travel controls into the private technology sector, deliberately blocking top AI talent from leaving the country without explicit government authorization.
28
May
China Airlines rides Taiwan’s AI boom to record cargo profits
China Airlines said demand tied to artificial intelligence (AI) infrastructure and semiconductor shipments is helping fuel a strong rebound in air cargo, underscoring Taiwan’s growing importance at the center of the global technology supply chain.
28
May
Computex 2026 adds robotics zone, Taiwan supply chain gathers
Computex 2026 will add a robotics zone for the first time, drawing Taiwan’s full ecosystem of sensors, motors, reducers, and system integrators, as Nvidia and AMD prepare to showcase robotics at CES 2026. The move has already stirred strong industry interest as the show extends big tech’s robotics roadmap.
28
May
Samsung foundry targets robotics, auto AI chips with Cadence platform
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNews reported, citing industry sources.
28
May
UMC readies price hikes, kicks off 2027 customer talks
UMC held its shareholders’ meeting on May 27, with CEO Jason Wang saying that as AI applications expand rapidly, long-term semiconductor demand still has room for growth. In addition to deepening its strengths in mature and specialty processes, UMC is also advancing next-generation technologies, including a US-based 12nm FinFET platform, advanced packaging, and silicon photonics, to prepare for future operating growth.
28
May
Yageo tops Murata in AI-driven passive component orders
Yageo, one of the world’s largest passive component suppliers, said demand from AI-related applications has pushed its book-to-bill ratio to 1.3, surpassing levels seen at Japanese peers, including Murata, as tightening supply across the sector continues to extend lead times.
28
May
Tsang Yow, a expands into high-end semiconductor equipment, plans Malaysia ramp in 4Q26
Tsang Yow, a major drivetrain manufacturer, expanded into high-end semiconductor equipment and planned a Malaysia production ramp-up in the fourth quarter of 2026 after posting 2025 consolidated revenue of NT$10.5 billion (US$334 million), up 0.3% year on year, with gross margin rising to 33% and net profit attributable to the parent company of NT$140 million. Earnings per share were NT$1.36, and executives said product-mix optimization, equipment replacement, inventory reduction, and tighter cost control drove the margin improvement.
28
May
Hotai Motor expects semiconductor and AI demand to lift Taiwan auto market in 2026
Hotai Motor Co. told shareholders on May 27 that Taiwan’s auto market was expected to strengthen in 2026 as demand for semiconductors and AI applications supported exports and the broader economy. The company forecast the full-year vehicle market could reach 440,000 units, attributing the outlook to a stabilizing global economy, policy continuity and a pickup in replacement demand.
28
May
Laster Tech enters the robot joint control supply chain and wins North American auto orders
Laster Tech announced it had broken into the robot joint control module supply chain and secured North American vehicle orders for its new Mexico plant, with small-volume robot shipments slated to begin in the third quarter of 2026 and vehicle deliveries targeted to start in the first quarter of 2027. The moves were presented as a strategic extension from the firm’s automotive electronics expertise into embodied intelligence robotics and as a step to strengthen local North American supply capacity.