MAtek sees record March revenue as AI and silicon photonics boost testing demand

MAtek’s March revenue surge has implications for global chipmakers and AI infrastructure providers: rising demand for advanced material and failure analysis testing linked to AI chip and silicon photonics development could strain testing capacity worldwide and influence timelines for advanced node adoption, optical communications deployment, and related investment.

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South Korea targets 2035 i-SMR commercialization, Doosan Enerbility eyes global contract manufacturing lead

South Korea has been actively advancing the development of small modular reactor (SMR) technology in recent years. The government, together with Korea Hydro & Nuclear Power (KHNP), is moving forward with next-generation i-SMR standard design certification and site selection for the first plant. Private-sector player Doosan Enerbility is taking the lead in positioning itself in the global SMR contract manufacturing market, backed by its largest-ever order volume.

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E Ink’s trade-show shift spotlights rivalry and could accelerate ChLCD commercialization

E Ink Holdings will forgo Touch Taiwan in 2026 to showcase at COMPUTEX, ceding a higher-profile presence at the domestic show to cholesteric liquid crystal e-paper maker IRIS Optronics. This move may reshape buyer attention and partnership dynamics in the e-paper sector. The decision reflects E Ink’s focus on large-size electrophoretic products and international buyers.

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GlobalWafers’ 12-inch line to run full in 2Q26 as wafer utilization rises

GlobalWafers reported March and first-quarter 2026 revenue that underscores transient operational disruptions with global implications: March consolidated revenue reached NT$5.45 billion (US$171.5 million), up 23.8% month-on-month and flat year-on-year, while first-quarter revenue fell amid holiday- and weather-related capacity impacts at overseas plants, prompting cautious market observation.

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SK Hynix M15X reportedly ramps early production

SK Hynix’s M15X is widely viewed as the company’s next-generation DRAM manufacturing hub in Cheongju, South Korea. Designed primarily to support high-bandwidth memory (HBM) output and advanced 1b DRAM production, the facility is built for AI-era workloads. Its exact status remains partially unconfirmed, but recent media reports point to early production activity and faster-than-expected equipment installation.

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