InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC’s Face-to-Face (F2F) SoIC technology, fully compliant with the UCIe 2.0 (Universal Chiplet Interconnect Express) standard. This marks a significant achievement for high-speed interconnect capability for heterogeneous integrated chips.

Connector maker CviLux held a groundbreaking ceremony for a new factory in Dongguan’s Changping region, as part of the company’s plan to accelerate the consolidation of production capacity in China. This comes amid the larger trend for manufacturers to relocate production outside of China due to ongoing tensions between China and the United States.

High-tech Innovators are all partnering with TSMC thanks to its industry-leading 2nm and A16 process technologies, which offer a crucial competitive edge in meeting the endless demand for energy-efficient computing, said the company during its latest earnings call on July 17.

OpenAI has diversified its cloud infrastructure beyond Microsoft Corp. to include Google Cloud, CoreWeave Inc., and Oracle Corp., underscoring the intensifying competition for scarce AI computing resources that has left multiple providers reporting capacity constraints in early 2025.