Generalplus has announced that its self-developed MCU product, the GPM32F9010RLQ, has passed the AEC-Q100 Grade 1 automotive-grade certification. This milestone represents the company’s initial entry into the automotive electronics market, with a product meeting stringent industry standards. The certification verifies that the MCU complies with critical automotive requirements concerning functional safety, environmental tolerance, and reliability.

Bosch Global Software Technologies (BGSW) has signed a Memorandum of Understanding (MoU) with Chennai-based fabless semiconductor startup Mindgrove Technologies to jointly develop high-performance system-on-chip (SoC) solutions aimed at applications in automotive, industrial automation, consumer electronics, and smart IoT infrastructure.

Taiwan’s telecommunications operators remain cautious about satellite phone services even after regulators cleared the way for applications, highlighting challenges in a market seeking differentiation amid fierce competition.

6月26日消息，消息源Panda Flash Pro昨日（6月25日）在X平台发布推文，曝料称三星首款三折叠手机将采用铝+钛合金材质，搭载骁龙系列芯片，并提供16GB内存。