速度提升100万倍！AGC与东京大学开发出激光加工玻璃新技术
据“AGC中国”，近日，AGC集团与日本东京大学共同发明了一种新方法，该方法能够以传统方法100万倍的速度对玻璃等透明材料进行激光加工。相关成果已于2025年6月11日刊登在美国科学杂志《Science Advances》网络版。
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Aug
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Aug
总投资10亿元，淮显光电AG玻璃及车载盖板制造项目建设竣工
近日，由淮安经济开发区第一建筑有限公司承建的江苏淮显光电科技有限公司（以下简称淮显光电）年产360万件光学玻璃车载盖板及500万件AG玻璃制造项目顺利竣工验收交付。
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Aug
总投资5.9亿元，汉能精密3D四面曲玻璃盖板生产基地首批产品正式交付
8月13日消息，据“阳泉广播电视台”，日前，在阳泉市郊区苇泊工业园区，汉能精密3D四面曲玻璃盖板生产基地的首批产品“走”下生产线正式交付市场。
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Aug
蓝思科技：目前正在配合客户开发下一代盖板玻璃
8月12日，蓝思科技(300433.SZ)近日在机构调研中表示，目前公司正与合作伙伴一道，配合客户开发下一代盖板玻璃，新的玻璃原片将应用创新配方，使盖板结构以及整机能够带来更加丰富的性能，以及更好的用户体验。
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Aug
信濠光电：董事、联席董事长、总经理白如敬辞职
8月12日，信濠光电公告，公司董事、联席董事长、总经理白如敬因个人原因，现辞去公司董事、联席董事长、总经理、董事会战略委员会主任委员及法定代表人职务，辞职后将不再担任公司及子公司任何职务。
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Aug
Exclusive: Infineon GaN chief on strategy, market gains after TSMC’s exit
Infineon Technologies’ acquisition of GaN Systems has bolstered its wide bandgap semiconductor portfolio. The move, combined with its shift to 12-inch gallium nitride (GaN) manufacturing, positions the company to extend its edge over rivals in cost efficiency, production capacity, and technological capability.
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Aug
Two Chinese robot firms join Nvidia to drive ‘physical AI’ boom
As AI shifts from the “information space” into the physical world, China’s leading robotics firms Unitree Robotics and Beijing Galbot are strengthening ties with Nvidia to speed the rollout of humanoid robots and embodied AI systems. Their target is a robotics market projected to be worth trillions of US dollars over the next decade.
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Aug
IPO wave puts China’s humanoid robot industry to the test
China’s humanoid robot industry is entering a rapid commercialization phase, with IPO pipelines expanding and capital inflows surging, as domestic manufacturers intensify competition while matching advances from US counterparts.
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Aug
TSMC adds US$10B to US subsidiary in strategic forex hedge
Taiwan Semiconductor Manufacturing Company (TSMC) held a board meeting on August 12, during which several key resolutions were made. Of particular interest was the approval to increase the capital of its wholly owned subsidiary TSMC Global by up to US$10 billion to reduce foreign exchange hedging costs.
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Aug
Samsung bets big on DRAM overhaul to reclaim HBM crown
Samsung Electronics is doubling down on its bet to regain leadership in high-bandwidth memory (HBM), the ultra-fast chip architecture powering next-generation artificial intelligence. The company has begun major equipment investments to mass-produce sixth-generation 10-nanometer-class DRAM (1c DRAM) — the core component of its upcoming HBM4 chips.