Taiwan’s lead negotiator and vice premier of the Executive Yuan Li-chiun Cheng held a press conference on August 11, 2025, during which she stated that since the US aims to become the global center for AI, there is significant room for complementary cooperation between Taiwan and the US. She emphasized that the government and industry players are joining forces to foster strategic collaboration, build a favorable foundation, and strive for better negotiation outcomes with the US.

Samsung Electronics and SK Hynix are poised to benefit from Washington’s reported decision to allow Nvidia to resume exports of its lower-tier H20 artificial intelligence chips to China, which contain the South Korean companies’ high-bandwidth memory (HBM) components.

The alleged leak of Taiwan Semiconductor Manufacturing’s (TSMC) 2-nanometer technology by former and current employees from TSMC and Tokyo Electron (TEL) has sparked intense speculation and espionage theories. Yet, closer examination suggests the incident may be less dramatic than many initially believed.

Nvidia is reportedly collaborating with its supply chain to develop an advanced packaging architecture called Chip-on-Wafer-on-PCB (CoWoP) for its Rubin GPU platform. This new design replaces the conventional ABF substrate with a PCB board, potentially revolutionizing packaging methods for AI servers amid intense industry debate.