TSMC has donated several sets of used 12-inch chipmaking equipment to the government, which has had the Industrial Technology Research Institute (ITRI) under the Ministry of Economic Affairs (MOEA) and the Taiwan Semiconductor Research Institute (TSRI) under the National Institute of Applied Research (NIAR) receive them on its behalf. TSRI has selected a site on the campus of National Yang Ming Chiao Tung University (NYCU) to build a 12-inch wafer fab where proof-of-concept and pilot lines will be installed using the equipment. The facility is expected to officially commence operations in 2028.

Following its major deal with Tesla, Samsung Electronics has won an order from Israeli IC design company Valens Semiconductor to manufacture next-generation automotive system chipsets based on the MIPI A-PHY standard. The chips are expected to be produced using FinFET process technology.

Taiwan’s Aerospace Industrial Development Corporation (AIDC) announced on Sunday that it has signed a formal teaming agreement with US defense technology company Shield AI, marking a major step toward developing an integrated, end-to-end ecosystem for advanced unmanned aerial systems (UAS) in the Indo-Pacific.