ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial intelligence (AI) and high-performance computing (HPC) applications. The advanced fan-out chip-on-substrate (FOCoS) solution significantly reduces chip energy loss to one-third of current levels, providing a leap in energy efficiency and performance.

As Elon Musk returns to the helm of his business empire, two of his ventures are making headlines. AI startup xAI is reportedly raising US$300 million at a US$113 billion valuation, while Neuralink has closed a US$650 million funding round to advance its brain-computer interface technologies.

Arm Holdings has announced a major rebranding initiative and confirmed plans to enter the chip design space—a strategic pivot that could position the UK-based architecture firm in direct competition with its own customers. The disclosure coincided with the company’s fourth-quarter revenue surpassing US$1 billion, pushing its full-year revenue projection above US$4 billion for fiscal 2025.