Japan’s SoftBank has partnered with Intel to co-develop cutting-edge DRAM tailored for AI applications, aiming to challenge the incumbent High Bandwidth Memory (HBM) technology. The new chip initiative could receive backing from the Japanese government and is part of a broader national effort to revitalize Japan’s semiconductor ecosystem.

BOE Technology Group is fast-tracking its 8.6-generation (8.6G) OLED production line in Chengdu, raising red flags for South Korean display makers. Having already ceded LCD leadership to China, South Korean firms now worry their edge in OLED may also be under threat.

Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei addressed key concerns on June 3, 2025, during a shareholder meeting, touching on currency volatility, global trade issues, technology leakage risks, and the company’s strong business outlook. Wei reassured investors that despite near-term macroeconomic pressures, TSMC remains focused on maintaining its technological leadership and expects record-high revenue and profit for the full year 2025.