禾臣新材完成过亿元B轮融资
据投资界10月29日消息,近日,安徽禾臣新材料有限公司(以下简称“禾臣新材”)完成过亿元B轮融资,由国泰君安创新投资与中车国创基金联合领投,金圆资本、派维投资等产业方共同投资,资金将主要用于8.6代空白掩模版(Blank Mask,光掩模版基板)与半导体先进制程抛光垫产能扩充,同时加大与战略客户研发配套投入,以满足市场需求。
As Moore’s Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of IC substrate technology and the global PCB landscape. Henry Utsunomiya, President of Fujitsu Interconnect Technologies (FICT) under Fujitsu Limited, noted that with heterogeneous integration now the dominant approach, the industry is undergoing a crucial shift from organic to inorganic substrates.
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