Taiwan’s printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence (AI), 5G/6G communications, and automotive electronics. However, they face challenges, including supply chain vulnerabilities, talent shortages, and a lack of unified packaging standards. Devan Iyer, CSO for Advanced Electronic Packaging at the Global Electronics Association, outlined these issues and opportunities in an exclusive interview with DIGITIMES.

Over the past decade, China’s tech sector has surged across chip design, foundry, and packaging. Yet beneath the slogan of “technological self-reliance”, two corporate storms have laid bare the contradictions between global ambition and domestic control, exposing the limits of China’s bid to lead the semiconductor world on its own terms.

The IEEE Asian Solid-State Circuits Conference (A-SSCC), a major annual event in the semiconductor field, recently announced its paper selection results, with six papers from Taiwan accepted.