Intel cuts jobs at Israel’s Fab 28 as new CEO rethinks global footprint

Intel has initiated job cuts at its Fab 28 wafer fabrication plant in Kiryat Gat, Israel, marking the first time the facility—one of the chipmaker’s three largest global manufacturing hubs—has been affected by broader company-wide downsizing. The move comes as new CEO Lip-Bu Tan accelerates efforts to streamline Intel’s sprawling global operations and eliminate organizational inefficiencies.

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Tariffs impact economy, but AI servers remain an exception, says Wistron

Wistron president and CEO Jeff Lin stated that AI servers represent a rigid demand and are not affected by reciprocal tariffs. However, mature consumer products such as notebooks and smartphones are likely to face challenges due to tariff impacts. Lin also revealed that in response to the US reciprocal tariffs, Wistron has prepared multiple contingency plans labeled Plan A, B, C, D, and E, although details of the tariffs remain unclear and customers have yet to provide definitive instructions.

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Exclusive: US drone makers Skydio, Anduril turn to Taiwan for key supply chain support

A wave of next-generation defense contracts from the US Department of Defense is poised to transform the global unmanned systems industry in 2025, and Taiwan may play a pivotal role. With the Pentagon expected to release a large volume of unmanned vehicle orders next year, US defense tech startups are racing to secure production capacity. Many of these firms, while brimming with innovation, face significant constraints in manufacturing scale, opening the door for Taiwan’s precision-driven, China-free supply chain.

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BOE pivots beyond displays to glass substrate packaging, perovskite solar

BOE Technology chairman Chen Yanshun revealed at the 2025 BOE Investor Day that the company will pivot toward glass substrate packaging and perovskite solar cell (PSC) technology as strategic growth drivers. The initiative targets high-value semiconductor backend processes and automotive electronics, aiming to diversify beyond BOE’s maturing display business.

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Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation for next-generation HBM4 and NAND flash memory exceeding 400 layers, SK Hynix is reportedly preparing to overhaul its wafer dicing technologies — a foundational step in semiconductor production that is becoming increasingly difficult due to thinning wafers.

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Huawei’s ‘Little HiSilicon’ launches all-out chip blitz: from RISC-V MCUs to AI edge SoCs

HiSilicon (Shanghai) Technologies — Huawei’s application-specific chip design arm known as “Little HiSilicon” — has launched a broad lineup of self-developed chips spanning IoT, industrial automation, smart home devices, visual AI, and energy management. The company also unveiled its first RISC-V-based chips, highlighting China’s accelerating push for independent innovation in semiconductor design.

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Unigroup’s US$14 billion comeback: post-restructuring push spans chips, global reach, IPOs

On July 11, 2025, Tsinghua Unigroup marked three years since its strategic overhaul with a strong performance report highlighting its resurgence in China’s high-tech sector. Over the period, the group generated more than CNY100 billion (approx. US$14 billion) in annual revenue for three straight years, filed over 30,000 patents (up 25%), and won the State Scientific and Technological Progress Award twice.

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