Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift is increasing the need for metrology, inspection, and failure analysis, and Zeiss is planning a semiconductor innovation center in northern Taiwan to support validation and application development.

Solomon Technology, a Taiwanese artificial intelligence (AI) 3D vision company, is showcasing two key inspection applications that integrate its core AI vision and optical technologies at Semicon Taiwan 2026. The applications include full-wafer warpage detection inside front-opening unified pods (FOUP)/cassettes and through-glass via (TGV) aperture defect inspection technology, aimed at preventing equipment downtime during manufacturing processes and ensuring the yield and quality of next-generation advanced packaging.

In addition to the AOC Q27U4D, AOC has also introduced two other models from the brand new AOC U4 series – the AOC U27U4D and the AOC U27U4. Although AOC provides full specifications for both models and we examined them closely, we were unable to identify any technical differences, despite the additional “D” in the model name. For now, we will treat them as separate entries in case the official…

At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research’s Holst Centre, the UK Semiconductor Centre, and the Taiwan Semiconductor Industry Association (TSIA) discussed the future of silicon photonics (SiPh). They said the industry’s bottlenecks have shifted from materials to packaging precision, materials platform selection, and the manufacturing tools needed to support both.