Hygon–Sugon merger retools China’s AI backbone with full-stack compute integration

Hygon Information Technology and Dawning Information Industry Co. (Sugon) announced a strategic merger on May 25, 2025, a move widely seen as aligning with Beijing’s agenda to consolidate its computing infrastructure and fast-track technological self-reliance. Hygon, valued at roughly CNY316 billion (US$43.95 billion), focuses on domestic CPUs and data processing units (DCUs), with five chip generations in use across finance, telecom, artificial intelligence, and enterprise data centers.

Continue reading

Acer Cyber Security leverages system integration to target double-digit growth in 2025

Acer Cyber Security Inc. (ACSI), the cybersecurity arm of Acer Group, expects stronger momentum in the second half of 2025 and is targeting double-digit revenue growth for the full year, according to President Rex Wu. Speaking at the company’s May 27 shareholders meeting, Wu cited sustained demand for cybersecurity solutions and the firm’s expanding system integration business as key growth drivers.

Continue reading

Gtoc bets on Vietnam and ultra-thin glass in push for display dominance

As global display technologies pivot toward thinner, lighter, and more flexible form factors — especially for automotive and smart device applications — Taiwanese glass processor Gtoc Optoelectronics is making a bold move into next-generation materials. The company announced a strategic expansion into the ultra-thin rollable glass cover market, positioning itself as a key supplier for high-end automotive displays and precision glass applications.

Continue reading

Nvidia partners with top chipmakers to develop 800V HVDC power systems for AI data centers

Nvidia has unveiled a bold move to revolutionize data center infrastructure with the introduction of an 800-volt high-voltage direct current (HVDC) power distribution system, designed for next-generation AI workloads. Announced recently, the initiative involves strategic partnerships with three major power semiconductor suppliers — Infineon Technologies, Texas Instruments (TI), and Navitas Semiconductor — to co-develop this advanced power solution.

Continue reading

Foxconn taps NTU, KAUST in μ-LED leap for next-gen optical and AI interconnects

With artificial intelligence driving explosive demand for high-speed data transfer, optical communication technologies are advancing in lockstep. Foxconn’s Hon Hai Research Institute (HHRI), in partnership with National Taiwan University (NTU) and King Abdullah University of Science and Technology (KAUST), has unveiled a breakthrough in multi-wavelength micro-LED (μ-LED) technology.

Continue reading

Taiwan to build chip alliance with ‘share values’ to counter China dumping

President William Lai’s initiative for a global democratic semiconductor supply chain represents Taiwan’s response and commitment to the restructuring of global supply chains, according to Minister of Economic Affairs J.W. Kuo. The Ministry of Economic Affairs (MOEA) will support foreign companies as they enter what Kuo describes as a golden era of partnership with Taiwan.

Continue reading

Flexium charts new growth path with leadership reshuffle, strategic focus on AI and robotics

On May 28, 2025, flexible printed circuit board (PCB) maker Flexium Interconnect held its annual shareholders meeting at its Kaohsiung facility, with chairman Ming-Chih Cheng presiding over the event. Marking a new chapter for the company, newly appointed president David Cheng—a United States-based executive—made his formal debut, outlining Flexium’s strategic roadmap for the years ahead.

Continue reading