Shanghai Auto Show 2025: Global carmakers unveil innovations as Tesla, Hyundai, and Kia sit out

The 2025 Shanghai Auto Show has drawn nearly 1,000 automakers and component suppliers from around the world. Chinese manufacturers continued to lead in presence, but a strong group of companies from Europe, the US, and Japan also presented their latest innovations. Notably, Tesla was absent for the third consecutive year. South Korean automakers Hyundai and Kia were also missing, underscoring shifting dynamics in the world’s largest auto market.

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AI lifts Taiwan’s substrate leaders: 2025 supply crunch nears resolution

Soaring demand for AI servers has propelled Taiwan’s ABF substrate leaders—Unimicron Technology, Kinsus Interconnect Technology, and Nan Ya PCB—to double-digit annual growth, ending a sluggish period of inventory corrections. As production scales and supply tightens, the market appears on track to reach equilibrium by late 2025, lifting hopes for a sustained rebound in the advanced packaging industry.

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Celestica smashes Q1 forecasts, lifts 2025 outlook as cloud and connectivity demand soar

Celestica, a leader in design, manufacturing, hardware platforms, and supply chain solutions, reported first-quarter 2025 financial results that decisively exceeded the upper end of its guidance. The company posted revenue of US$2.65 billion, representing a robust 20% year-over-year increase, propelled by broad-based strength across its key business segments. Adjusted earnings per share (non-GAAP) surged to US$1.20, a 45% jump from US$0.83 in the prior-year period, while adjusted operating margin reached a record 7.1%, up from 5.9% a year ago.

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Exclusive: Google considers HBM3E supplier change

Samsung Electronics has recently intensified its deployment in advanced high bandwidth memory (HBM) processes. However, supply chain sources reveal that Samsung’s HBM3E certification progress is once again facing obstacles. Google, which had planned to pair its self-designed AI servers chips with Samsung’s HBM3E and submit them to TSMC for CoWoS packaging, suddenly notified Samsung of the removal of HBM from its plans.

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