JEDEC rolls out HBM4 standard: 2TB/s memory poised to supercharge AI, HPC

The global push to meet surging demand from AI, high-performance computing (HPC), and advanced data centers has reached a new milestone. JEDEC, the international semiconductor standards organization, has unveiled the High Bandwidth Memory 4 (HBM4) specification—a next-gen memory standard featuring major architectural and interface upgrades for dramatically improved bandwidth, capacity, and power efficiency.

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Taiwan accelerates unmanned vehicle push amid global defense and tariff tensions with the US

As global trade grapples with the turbulence of tariff disputes, defense and military demands remain undeterred, emerging as pivotal bargaining chips in negotiations over reciprocal tariffs with the US. Unmanned vehicles have surged to the forefront of strategic priorities, with Taiwan’s drone industry already coalescing into a nascent national team.

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Ennostar preps 30-inch transparent Micro LED window display for smart vehicles

Ennostar, a leading developer in compound semiconductors, showcased major advancements in Micro LED technology at Touch Taiwan 2025, with a dual focus on innovation at both the component and application levels. The centerpiece of its exhibition included a cutting-edge GemiLED platform and a transparent 30-inch automotive display now ready for mass production.

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Micron challenges South Korean dominance in HBM market amid tariff protectionism

Recently, reports from South Korea claim that Micron is set to become a rising star in the HBM market, following Samsung Electronics and SK Hynix. Although Donald Trump’s current policies remain unclear, many in the South Korean industry predict that the US will adopt strict protectionist measures for its semiconductor industry. As a result, Micron, being a US company, is likely to benefit.

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