As the race to scale artificial intelligence computing accelerates, global technology companies are committing large sums to AI infrastructure. Capital spending is climbing rapidly, driving a sharp rise in power consumption. Infineon has put forward a “Vertical Power Delivery” (VPD) architecture aimed at improving efficiency, saying the approach can boost efficiency by about 10% while cutting power loss by a similar margin. Power semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) are emerging as key enablers of the design.

Kentec, a subsidiary of Kenmec Mechanical Engineering, is on track to achieve a significant profit turnaround by 2026 as it addresses rising demand for AI server cooling technology. As growing AI workloads push the physical limits of server chips, Kentec’s leadership is strengthening its position with new liquid-cooling innovations for large-scale data centers.

Outlook for the 2026 global data center ASIC competition: The changing strategic alliances between Arm, Qualcomm, and Nvidia will be the core key.