05
Mar
05
Mar
The Dell P2426HEB and Dell P2426HEV is the first pair from the 2026 Dell Pro P series of monitors
05
Mar
GIS eyes mass production of microLED AR glasses in 2H26 amid optical push
Touch panel maker GIS Holding said it has completed key processes and established strategic partnerships for optical and AI/AR device applications and expects some customers’ microLED AR glasses to reach mass-production milestones in the second half of 2026.
05
Mar
Hanmi Semiconductor strengthens ties with India amid Micron facility launch
South Korean thermal compression bonder leader Hanmi Semiconductor has announced the development of the industry’s first dual-function BOC COB Bonder, capable of performing both Board-on-Chip (BOC) and Chip-on-Board (COB) processes within a single system, according to Yonhap News Agency and Maeil Business Newspaper. The company says the equipment is designed to improve process flexibility and production efficiency for high-performance memory products.
05
Mar
Japanese-led price surge in inductors could reshape mid-to-high-end passive components market and shift share to Taiwanese suppliers
Global passive components suppliers are entering a new price-hike cycle in 2026 as Murata Manufacturing and TDK Corporation prepare steep increases for inductors, with reported single increases exceeding 100% that will also affect ferrite beads and high-frequency inductors. The move is drawing attention across the supply chain.
05
Mar
Egis showcases satellite and drone integration at MWC 2026
Egis Technology and its subsidiaries are jointly exhibiting at the 2026 Mobile World Congress (MWC 2026). Centered on integrated terrestrial and space connectivity, physical AI, and low-power intelligent computing, the group is highlighting its comprehensive capabilities in satellite IoT, edge AI visual perception, drone system integration, ultra-low latency wireless transmission, and ultra-low power AI chips.
05
Mar
WT Microelectronics sees 2026 growth despite memory price hikes
The semiconductor market in 2026 is expected to be driven by strong AI demand but faces challenges from rising prices of memory and passive components. WT Microelectronics said the impact of memory price increases, along with localized hikes in passive component costs, remains manageable for its operations. Data center expansion is also fueling a surge in power IC demand, positioning WT Microelectronics’ 2026 momentum to surpass that of 2025. The company plans to continue investing in high-growth sectors such as data centers and servers.
05
Mar
Glass fiber shortage hits IC substrates, MGC follows Resonac with 30% CCL price hike
Demand from Nvidia and Apple has intensified shortages of high-end glass fiber cloth used in IC substrates, driving broad price increases for related materials and squeezing profit margins for copper clad laminate (CCL) suppliers. Japanese materials makers have recently taken the lead in raising prices, shifting rising costs downstream to customers and end markets.
05
Mar
Beyond EMS: Lens Technology ships PCIe 5.0 enterprise SSDs, moves into AI data center storage
Lens Technology said SSDs assembled for enterprise NVMe storage supplier DERA have entered mass shipment at its facility in the Xiangtan Economic and Technological Development Zone, marking the company’s expansion into the high-end data center storage supply chain.
05
Mar
Column: US drone policy reshapes supply chain opportunities for Taiwan
On June 6, 2025, US President Donald Trump signed two executive orders—”Unleashing American Drone Dominance” and “Restoring American Airspace Sovereignty”—mandating that the US drone industry exclude technology, parts, and materials from controlled countries (China, Russia, Iran, North Korea). The orders encourage adopting allied technologies to build an autonomous, resilient domestic ecosystem supporting the low-altitude economy and critical defense needs.