Tsinghua Unigroup’s former “chip-to-cloud” expansion strategy unraveled after a debt crisis in 2020 and subsequent bankruptcy restructuring. Several projects originating in the group’s earlier era have since entered disposal proceedings, and one of the former group’s largest planned investments has now reached a formal end.
TSMC is expanding cooperation with packaging and testing affiliate Xintec as it develops next-generation power delivery and advanced packaging for AI chips, while market speculation points to a broader outsourcing role for the company in CoWoS back-end assembly.
VeriSilicon posted record first-half 2026 revenue of CNY1.86 billion (US$276 million), up 91.37% year-on-year, as AI computing demand lifted custom silicon and mass-production services.
China’s humanoid robot industry is entering a larger real-world test of AI, mobility and performance, with 2,056 robots set to compete in Beijing as domestic makers including Unitree Robotics accelerate development of faster and more capable machines.
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