05
Jan
05
Jan
Asus ROG Strix OLED XG34WCDMS with Samsung’s V-stripe 5th Gen QD-OLED panel is also unveiled
05
Jan
Asus ROG Swift OLED PG27UCWM debuts with LG Display’s 4th Gen Tandem WOLED panel
05
Jan
Asus ROG Swift OLED PG34WCDN with Samsung’s 5th‑Gen QD‑OLED panel goes official
05
Jan
Ericsson highlights Taiwan’s CPE and RF edge ahead of 6G rollout
The global mobile communication standard is rapidly advancing toward 6G. Facing the next-generation technology race, Ericsson Taiwan president David Chou noted that Taiwanese manufacturers hold advantageous positions in customer premises equipment (CPE) and chip supply chains. However, he advised Taiwan to accelerate its transition to a standalone (SA) 5G network architecture to prepare for future developments.
05
Jan
Black Sesame’s Huashan A2000 clears US Commerce, Defense reviews, secures global sales approval
Black Sesame Technologies has secured a rare regulatory breakthrough for a China-based automotive AI chip developer. On January 4, 2025, the company said its high-performance Huashan A2000 intelligent driving SoC had cleared reviews by the US Department of Commerce and the US Department of Defense, allowing global sales and deployment. The decision effectively moves the A2000 into large-scale commercialization, an outcome few peers have achieved under current regulatory conditions.
05
Jan
Etron Technology to showcase edge AI memory and robotics platforms at CES 2026
Etron Technology is concentrating its edge AI strategy on four pillars: memory, intelligent vision sensing, high-speed transmission, and privacy computing. Under the theme “MemorAiLink show up,” the company will present its edge AI portfolio at CES 2026, targeting AI and robotics growth opportunities.
05
Jan
Chunghwa Precision Test Tech to build new plant in Taoyuan amid growing semiconductor demand
Chunghwa Precision Test Tech (CHPT), a subsidiary of Chunghwa Telecom, plans to start construction of its third Pingzhen plant in Taoyuan in early 2026, with completion expected by early 2028. Production could begin in the second half of 2028, supporting the company’s medium- to long-term capacity expansion in the semiconductor sector.
05
Jan
Taiwanese network equipment suppliers ramp up investments as shift to 800G and 1.6T standards proceeds
Driven by surging demand for AI and cloud data centers, the network equipment industry is rapidly advancing from 400G to 800G and beyond to 1.6T specifications. This technological leap is prompting structural changes across connectors, cabling, cooling systems, optical communications, and overall system architectures, marking a new phase in the development of high-performance computing.
05
Jan
Qualcomm cloud AI ASIC business strategy
Qualcomm advances from edge to cloud AI ASIC, challenging the existing cloud computing power supply chain landscape.