05 Jan
Latest News and Trends

GTOC signs 5-year US defense deal for aerospace glass conformal antennas

G-Tech Optoelectronics (GTOC), a glass processing subsidiary of Hon Hai Precision Industry (Foxconn), announced it has signed a five-year framework agreement with a US defense systems integration contractor, covering the period from December 31, 2025, to December 30, 2030. The partnership will comply with relevant defense, national security, export control, and supply chain security regulations in the US, Japan, and Taiwan.

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05 Jan
Latest News and Trends

AI data centers pivot to HVDC as power management rivals memory in infrastructure priority

Nvidia’s push for an HVDC 800V power design has opened a new growth window for the power management supply chain heading into 2026. IC distributors said that as AI infrastructure investment accelerates, demand for 400-800V solutions is gaining traction. With Taiwanese firms stepping into power module development, component demand is set to rise in tandem.

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05 Jan
Latest News and Trends

Samsung bets on smart driving, testing old alliances

Samsung Electronics’ decision to acquire a major advanced driver-assistance systems (ADAS) business through its subsidiary Harman is widely viewed as a decisive escalation of its ambitions in automotive electronics. Yet the move is also stirring unease among industry observers, who warn that it could complicate Samsung’s long-standing partnership with Hyundai Motor Group, raising questions about how the two South Korean giants will navigate an increasingly crowded and competitive automotive technology market.

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05 Jan
Latest News and Trends

TSMC kicks off 2nm production with Samsung in hot pursuit

The global foundry race has entered a new phase after TSMC announced it has begun volume production of its 2nm process, intensifying competitive pressure on Samsung Electronics as the two chipmakers vie for leadership at the industry’s most advanced manufacturing node. The move is closely watched across the semiconductor sector because 2nm technology is expected to underpin the next generation of AI, mobile, and high-performance computing chips, shaping pricing power, customer relationships, and supply-chain diversification.

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05 Jan
Latest News and Trends

Inpaq CEO Pei-Jen Chen launches resource realignment plan

Inpaq Technology, a passive components maker under the Walsin Technology Group, has launched an internal resource realignment plan. Newly appointed CEO and president Pei-Jen Chen stated that the company is emphasizing shortening time to market by integrating sites and centralizing development to build flexible capacity allocation capabilities. Inpaq intends to launch new products every month in 2026.

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05 Jan
Latest News and Trends

Lee Jae-myung’s first China visit signals warming South Korea-China ties

According to Bloomberg and The Korea Economic Daily, South Korean President Lee Jae-myung made a four-day trip from January 4-7, 2026, to Beijing and Shanghai, including a meeting with Chinese President Xi Jinping. The heads of the four major South Korean conglomerates (Samsung, SK Group, Hyundai, and LG Group) also traveled with Lee as part of an economic delegation.

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