夏普11.6亿元出售堺市总部大楼给积水化学
12月26日，鸿海旗下夏普表示，已经与积水化学工业株式会社就以250亿日元（约合11.6亿元人民币）转让本公司所持有的固定资产达成协议，资产包括位于大阪府堺市的建筑物等。
26
Dec
26
Dec
柔宇科技旗下资产二拍流拍，较一拍降价20%
12月25日消息，今日早间，深圳柔宇显示技术有限公司（下称“柔宇显示”）名下资产二拍流拍。阿里资产网显示，二拍起拍价为9.84亿元，较一拍降价20%，此次拍卖超5000次围观。
25
Dec
SK Hynix prepares for mass production of 16-layer HBM3E amid intensifying competition
As competition in the high bandwidth memory (HBM) market escalates, SK Hynix is on track to begin mass production of its 16-layer HBM3E products as planned. The significance of this achievement is heightened by the fact that the same stacking technology will be applied to HBM4.
25
Dec
China’s EV price war: 2 years of financial turmoil and supply chain chaos
China’s electric vehicle (EV) industry has endured a two-year price war, leading to significant profit compression across the supply chain. Automakers have slashed costs to defend their market share, but this strategy has intensified upstream financial strain. Suppliers face cash flow crises, disrupting component stability and driving up costs, creating a self-perpetuating cycle of instability.
25
Dec
Megaforce embraces AI to drive smart healthcare innovations
Megaforce, a Taiwan-based leader in precision plastics molding, laser optics, and biomedical solutions, is ramping up its focus on AI applications. The company now offers system integration, AI model development, database construction, and on-premises computing capabilities.
25
Dec
AI-powered inkjet tech breakthrough enables precision coating for advanced semiconductors
Elephantech, a Tokyo-based printed electronics manufacturer, has introduced NeuralJet™, an artificial intelligence (AI)-powered inkjet technology that improves precision in semiconductor packaging applications through the correction of printing variations. The technology addresses specific challenges in advanced packaging processes, including those used in AI semiconductor production.
25
Dec
Mitsubishi Electric unveils 6th QZSS satellite, advancing smartphone positioning precision to one meter
Mitsubishi Electric has unveiled the sixth satellite in Japan’s Quasi-Zenith Satellite System (QZSS) at its Kamakura Works facility. Scheduled for launch by the H3 rocket by the end of March 2025, the satellite features a groundbreaking “high-precision positioning system.” This technology promises to enhance the positioning accuracy of smartphones to within one meter without requiring hardware modifications.
25
Dec
Samsung, TSMC diverge on panel materials for advanced packaging
Samsung Electronics and TSMC are advancing in next-gen fan-out panel-level packaging (FOPLP), but their strategies differ. Samsung is sticking with plastic, leveraging its experience in mobile chips, while TSMC is exploring glass panels, banking on cost and efficiency gains for AI semiconductors.
25
Dec
Taiwan govt US$900 million budget cut threatens tech subsidies and water infrastructure
The recently approved amendment to Taiwan’s Act Governing the Allocation of Government Revenues and Expenditures has resulted in a NT$375.3 billion (approx. US$11.8 billion) annual reduction in regular revenue for the central government. Minister of Economic Affairs Jyh-Huei Kuo, who recently returned from a visit to Europe, announced on December 24, 2024, that the Ministry of Economic Affairs (MOEA) will face an annual budget shortfall of NT$29.7 billion (approx. US$930 million). This deficit will disrupt key initiatives, including crucial water resource development and technology subsidy programs.
25
Dec
Qualcomm’s legal win could reshape Arm licensing landscape
Following Qualcomm’s recent victory in its patent dispute with Arm, industry analysts are examining the broader implications for semiconductor licensing practices. The US jury verdict, which validated Qualcomm’s use of technology acquired through its US$1.4 billion Nuvia purchase, could set precedents for future acquisitions in the chip industry and influence how intellectual property rights are transferred during mergers.