Nvidia’s robotics chief says the industry is building the wrong brains

Although AI has made tremendous progress in the digital domain, intelligence in the physical world still faces many challenges. Robots need to perceive 3D space, manipulate objects, and understand physical rules, all of which require enormous investments of manpower and resources. Dr. Jim Fan, head of Nvidia’s robotics business and co-head of the GEAR lab, recently posted on X criticizing the current state of the robotics industry. Looking back at developments in robotics in the year now coming to an end, he argues that the robotics field remains in a state of chaos, and that its development direction may be wrong.

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BOE to lead global TV panel shipments in 2026; industry forecasts remain mixed

BOE Technology Group (BOE) is poised to retain its position as the world leader in TV panel shipments in 2026, with market projections showing stable volumes after a significant increase in 2025. Industry sources note that while BOE strengthens its foothold, other major panel makers face a complex landscape shaped by supply chain dynamics and cost pressures.

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Academic research for AI robots to focus on causal reasoning and chain-of-thought

The field of AI robots has now entered a phase of rapid development and iteration, as evidenced by optimistic predictions from Nvidia CEO Jensen Huang and Tesla CEO Elon Musk. As noted by the National Science and Technology Council (NSTC), key technologies for building advanced AI robots in the future include semantic reasoning, task decomposition, causal inference, chain-of-thought, multi-step reasoning, and cross-domain generalization capabilities.

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TSMC reportedly speeds up Arizona 3nm fab plans as Samsung woos US clients in Texas

According to South Korean media reports and industry sources, TSMC is moving to pull forward the production schedule at its second Arizona facility, a shift that could reshape supply planning for major chip designers and weaken the long-running narrative that Samsung Electronics stands as the default alternative when TSMC capacity tightens.

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Foxconn’s FIH Mobile may start new smartphone product development in Vietnam by 2026

Under ongoing geopolitical risks and rising tariff barriers, Foxconn Technology Group’s smartphone assembler FIH Mobile plans to shift part of its new product introduction (NPI) operations from China to Vietnam starting in 2026, sources say. This move marks a significant step as the industry adapts to heightened supply chain resilience demands amid US-China tech tensions.

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