30
Dec
Since joining Google, DeepMind co-founder Demis Hassabis has been shaping the company’s artificial intelligence development strategy, emphasizing the importance of “world models” over large language models (LLMs) alone, Bloomberg reports. Despite his scientific stature and technical contributions, Hassabis has yet to oversee the launch of a major consumer AI product.
29
Dec
Infineon outlines AI power trends toward vertical supply and DC microgrids
Infineon is leveraging its technological strengths to expand into cutting-edge applications in AI data centers and robotics. The company is currently collaborating with Nvidia to develop power systems for next-generation AI racks, featuring direct current (DC) voltages up to 800V.
29
Dec
Smartphone market 2026: Can AI, smart glasses, and foldables revive demand?
Tariffs, inflation, and geopolitical risk continue to cloud the global economy, while the smartphone industry faces fresh pressure from higher upstream material costs and component shortages. As 2026 approaches, several structural issues are set to define the market’s direction.
29
Dec
After subsidies end, Germany’s EV market hits turning point
In the transformation of automotive electronics and electrification (E/E), subsidies have long been regarded as the fuel propelling the shift. Yet in 2025, Germany’s electric vehicle (EV) market is experiencing what could be described as a “sudden assault after the rations end.”
29
Dec
SK Hynix weighs US expansion for advanced chip packaging
According to South Korean technology outlet ZDNet Korea, SK hynix is reviewing plans to build its first 2.5D advanced packaging mass production line in the US, a move that would deepen the South Korean memory maker’s role in supplying memory for artificial intelligence systems.
29
Dec
IntelliEPI partners with EZconn to boost AI optical communication
The surge in AI-driven high-speed computing and data transmission demands has prompted major players to invest heavily in co-packaged optics (CPO) technology. Compound semiconductor firm IntelliEPI announced a share-swap partnership with optical communications company EZconn, drawing renewed market attention.
29
Dec
South Korea expected to reclaim no. 2 in global chip equipment spending by 2026
South Korea is on track to significantly increase semiconductor equipment investment in 2026 as rising demand for high-bandwidth memory (HBM) and advanced DRAM drives a new wave of capacity expansion, positioning the country to overtake Taiwan and regain second place globally behind China.
29
Dec
Taiwan’s Wonderful Hi Tech projects double-digit growth in 2026 on AI and satellite demand
Global high-performance transmission cable maker Wonderful Hi Tech offered an optimistic outlook at its investor briefing on November 18, 2025. Despite a slight year-over-year revenue decline in the third quarter of 2025—attributed to the end of pre-stockpiling by clients ahead of tariff changes—company executives said the inventory adjustment is expected to conclude by year-end, setting the stage for a robust start to 2026. With continued growth in AI and low-Earth-orbit (LEO) satellite markets, the company anticipates 2026 will be a high-growth year.
29
Dec
Taiwan quake hits chip fabs, but Nanya says operations largely unaffected
A magnitude-7.0 earthquake struck offshore Yilan late on December 27, 2025, rattling northern Taiwan. The quake prompted precautionary shutdowns across Hsinchu Science Park. Several chipmakers activated emergency protocols. But Nanya Technology Corporation said on December 29, 2025, that the impact on its operations and finances was minimal. The update eased concerns over potential memory supply disruptions.
29
Dec
Move over, Malaysia? India’s emerging OSAT sector claims price parity in legacy packaging
India’s first wave of OSAT facilities is moving from capacity announcements to competitive positioning, with some domestic players now benchmarking themselves against established backend hubs rather than solely against local peers.