Former TSMC executive set to depart Samsung after two years as advanced packaging division restructures

In early 2023, Samsung Electronics welcomed former TSMC deputy director Jing-cheng “Vic” Lin to lead an advanced packaging task force to compete against TSMC. However, industry insiders indicate that this task force has recently been disbanded. There are rumors that Chinese wafer fabs are attempting to recruit Lin, making his next move highly anticipated.

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