Foxtron writes a new chapter in Taiwan auto history

Taiwan’s auto market has faced plenty of challenges in recent years, from broader industry headwinds to continued scrutiny of domestic car production. Against that backdrop, Foxconn-backed Foxtron is emerging as a fast-growing contender, delivering solid results in both domestic sales and local manufacturing while opening the door to exports and setting up a historic milestone for Taiwan’s auto industry.

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RoboTechnik completes Hong Kong listing to fund ficonTEC expansion in silicon photonics

RoboTechnik completed a Hong Kong listing on September 29 and began trading on the Hong Kong stock exchange, according to its German photonics automation subsidiary ficonTEC. The new capital will be used for further investment in ficonTEC, which is expanding its role in silicon photonics and optical interconnect manufacturing for AI and high-performance computing infrastructure.

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AIDC sees NT$30 billion military maintenance boost, eyes drones

As the last Brave Eagle advanced trainer rolls off the line in September 2026, Aerospace Industrial Development Corporation (AIDC) says its military business is not ending with the trainer’s development and mass production program. Instead, a new phase is just beginning, with maintenance and spare-parts supply contracts for the Indigenous Defense Fighter and Brave Eagle expected to generate more than NT$30 billion (US$941.3 million) in value.

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Samsung reshuffles DRAM roadmap, prioritizing B1b hybrid bonding for D0a, HBM5

Samsung Electronics is reshaping its next-generation dynamic random-access memory (DRAM) roadmap, elevating its B1b wafer-to-wafer (W2W) hybrid bonding technology from a project-specific development to the core technology behind D0a, its first sub-10nm DRAM generation. Industry observers believe Samsung’s push to commercialize B1b DRAM earlier could also benefit its next-generation high-bandwidth memory (HBM) products, including HBM5.

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In global semiconductor race, Singapore bets on critical, mature technologies

Amid the ongoing restructuring of the global semiconductor supply chain, Singapore is focusing on advanced packaging, heterogeneous integration, silicon photonics, and optical interconnects, aiming to leverage nearly six decades’ worth of manufacturing and supply chain expertise. In contrast with industry players in Taiwan, South Korea, and the US, who have continued to pour resources into 2nm and 1.4nm advanced processes, Singapore’s semiconductor firms see no need to replicate Taiwan’s foundry model. Instead, they aim to harness Singapore’s existing strengths in mature and specialty processes, assembly and testing, equipment, materials, and multinational R&D clusters to secure their foothold in the supply chain for next-gen semiconductors.

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AI boom sends China and Taiwan’s PCB makers racing to HK for capital

Global investment in AI infrastructure is expanding rapidly, driving specification upgrades across the supply chain, from AI servers to high-speed optical modules, and pushing printed circuit boards (PCBs) into a more critical role in compute upgrades. As technical complexity and product prices rise together, PCBs are quickly redefining their value in the electronics supply chain.

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Column: Why Micron’s US$250M venture fund is about more than HBM margins—Taiwan has a stake in it

Micron unveiled the Micron Ventures Paradigm Fund, a US$250 million venture vehicle, in mid-August 2026, as the memory maker pairs more than US$25 billion in fiscal 2026 capex with a pledge to invest more than US$250 billion in the US by 2035. The fund is designed to give Micron an early look at technology shifts, position it for next-generation AI architectures, and strengthen its strategy to reduce memory-cycle volatility.

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