Tmytek, a Taiwan-based specialist in millimeter-wave phased-array technology, has formally filed for listing on Taiwan’s Innovation Board — a tech-focused public market for high-growth companies — becoming the first applicant for the exchange’s 2026 intake. The move comes as the company pursues a broad expansion into satellite communications, defense systems, and next-generation wireless infrastructure.

Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications, faster cloud computing and data center expansion, and steady growth in demand from new energy-related industries are boosting demand for high-end electronic materials and high-frequency, high-speed printed circuit board (PCB) markets.

Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.