Samsung Foundry nears 60% 2nm yield, shifts focus to power efficiency to win customers
US, China eye US$60 billion in tariff relief, but chips stay off the table
Samsung Electro-Mechanics to invest US$5 billion in ABF substrate expansion
Solidigm weighs US IPO as AI storage demand lifts valuation
MicroIP unveils AI drone and edge systems at Taiwan Expo USA
Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal
At Singapore’s Innovate Together 2026 conference on September 25, executives and researchers from A*STAR’s Institute of Microelectronics (IME), KLA, ASM International, the National University of Singapore (NUS), the SHINE Centre, and ASMPT discussed how advanced packaging is evolving beyond conventional chip integration, with optical interconnects, panel-level packaging, and talent development emerging as key challenges.
HAA free tuition enrollment draws Silicon Valley buzz
The Horowitz Andreessen Academy (HAA), a separate education company incubated by Andreessen Horowitz, or a16z, has officially launched and opened applications for its first class. Based in San Francisco, the private full-time school primarily targets recent high school graduates, although students with up to one year of full-time college enrollment may apply, and aims to position itself as a “college alternative.”
Column: Beyond Zero Trust – why AI supply chain resilience needs a plan B
Advantech’s North America expansion signals a deeper shift toward local manufacturing, services
Advantech is expanding manufacturing, engineering, and fulfillment capabilities in North America as demand grows for locally designed and assembled systems across industrial technology markets. The move reflects broader US reshoring efforts, tighter supply-chain requirements, and rising customer interest in regulatory compliance and resilience.