On August 6th, WT Microelectronics, a leading IC distributor based in Taiwan, held its investor conference where Chairman Simon Cheng expressed confidence that current semiconductor market headwinds are only a short-term phenomenon.
The US Department of Commerce and SK Hynix have signed a non-binding preliminary memorandum of terms to provide up to US$450 million in proposed federal incentives under the CHIPS and Science Act to establish a high-bandwidth memory (HBM) advanced packaging fabrication and R&D facility in Indiana.
One month into the UK’s new Labour government taking office, the shelving of key AI projects has signalled a major shift in the country’s tech policies. Recent reports indicate that the new government plans to scrap two major computing infrastructure projects collectively worth GBP1.3 billion (US$1.7 billion).