Micron Technology has announced that it is shipping ninth-generation (G9) TLC NAND in SSDs, making it the first in the industry to achieve this milestone.
The Biden Administration has announced that the CHIPS and Science Act will subsidize US$400 million to help Amkor, the largest semiconductor packaging and testing company in the US, build a new US$2 billion semiconductor packaging plant in Peoria, Arizona.
At CyberLink’s Q2 earnings call, Chairman and CEO Jau Huang outlined the company’s strategy to integrate generative AI and AI PC technologies into its software suite. Huang acknowledged the immense pressure CyberLink has faced competing against Microsoft in the PC software domain, and identified Adobe as the key rival in the generative AI landscape.