Samsung reveals silicon capacitors and 3.5D packaging roadmap

Jeong Gi-tae, vice president of Samsung Electronics’ foundry business unit, recently revealed the development roadmap for the company’s wafer foundry technology at an industry-academic exchange conference in South Korea. This includes new technologies such as silicon capacitors, demonstrating that Samsung’s technology is not falling behind competitors like TSMC and expressing high optimism about future improvements.

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PCB top players gather at TPCA 2024, eye AI-driven growth

TPCA Show 2024, Taiwan’s premier PCB manufacturing event, spotlights the theme “Innovative AI in PCB,” reflecting the transformative impact of generative AI technologies like ChatGPT. The rise of AI is pushing PCB makers to leverage these advancements for new growth opportunities and improved production efficiency, underscoring the industry’s pivot toward AI integration.

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