CXMT’s initial HBM capacity in Hefei reaches one-third of Korean manufacturers

Reports indicate that China’s DRAM leader ChangXin Memory Technologies (CXMT) is actively investing in high bandwidth memory (HBM) production capacity. Currently, CXMT is establishing a production line at its Hefei site, with a monthly capacity of 50,000 units (based on 12-inch wafers). Hefei is expected to become a major HBM production hub for CXMT.

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Samsung’s DS division unveils new ‘C.O.R.E’ system in response to labor strikes

Due to ongoing strikes, Samsung Electronics may face a semiconductor production crisis in the second half of 2024. To address communication issues between departments, Young-hyun Jun, head of Samsung’s Device Solutions (DS) division, has introduced a new organizational culture called “C.O.R.E.,” emphasizing internal communication and data-driven decision-making.

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Samsung yet to escape wafer foundry struggles, may see losses in ‘trillions of KRW’ in 2024

Despite a strong overall performance in the second quarter of 2024, Samsung Electronics continues to grapple with losses in its wafer foundry business. Most analyses indicate that the gap between Samsung and TSMC is widening. Moreover, Samsung’s difficulties in securing big tech customers could lead to further declines in market share if the company fails to improve its foundry process yield rates and technology in time.

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